H3C UniServer R4900 G7 Product images

    H3C · R4900 G7

    H3C UniServer R4900 G7

    H3C UniServer R4900 G7 is the latest 2U dual-socket rack server with Intel Xeon 6 processors, PCIe 5.0 and CXL expansion, for general computing, AI training/inference and HPC.

    • 2× Intel Xeon 6 Processor·Up to 144 Cores
    • 32× DDR5 Slots·Maximum 8TB·CXL Expansion
    • Up to 45× 2.5 Inch drives·E3.S SSD
    • Supports 6 Double-width cards or 18 Single-width cards GPU

    Published model specifications describe available options, not the delivered configuration.

    Configurations & prices

    Each row is one configuration; CPU, components and price belong to the same SKU.
    ProcessorConfigurationConfiguration price (USD)
    1 × 6515P16GB Memory | 1 × 2TB SATA Drives | Single PSU$4,660
    1 × 6515P32GB Memory | 1 × 4TB SATA Drives | Single PSU$5,240
    1 × 6515P32GB | 960GB SSD | Single PSU$5,320
    2 × 6515P16GB Memory | 1 × 2TB SATA Drives | Single PSU$5,830
    1 × 6515P32GB Memory | 2 × 1.2TB 10K SAS Drives$5,900
    1 × 6515P32GB Memory | 3 × 1.2TB 10K SAS | H460$6,110
    2 × 6515P32GB Memory | 3 × 1.2TB 10K SAS | H460$7,280
    1 × 6515P64GB | 2 × 480GB | 3 × 8TB | Single PSU$7,770
    2 × 6515P64GB | 2 × 1.2TB | RAID1$8,020
    2 × 6515P64GB | 3 × 2.4TB | RAID5$8,620

    Listed prices are indicative; confirm tax, stock, compatibility, lead time and service in a written quotation.

    Specifications & selection notes

    Processor

    Processor type2× Intel® Xeon® 6 Processor (Birch Stream)
    Processor platformSP (Scalable Performance) / AP (Advanced Performance)
    Maximum core countUp to 144 cores per processor
    Maximum TDP330W

    Memory

    Memory slots32× DDR5 DIMM Slots
    Memory data rateSP: 6400MT/s (RDIMM) / AP: 8800MT/s (MRDIMM)
    Maximum memory8TB
    CXL ExpansionSupports CXL Additional expansion 32 Memory slots

    Storage

    Drive countUp to 45× 2.5 Inch drives
    Drive typeSAS/SATA/NVMe HDD/SSD
    E3.S SSDUp to 36/40× E3.S SSD
    E1.S SSD8× E1.S SSD
    Boot driveSATA/NVMe M.2,Dual SD Card module(DSD)

    RAID

    RAID LevelRAID 0/1/5/6/10/50/60
    Storage controllerOptional Dedicated Mezz Slot or standard PCIe Storage controller

    GPU/Accelerator

    Double-width GPUUp to 6 Units
    Single-width GPUUp to 18 Units

    Networking

    Management port1× 1Gbps Dedicated management port
    OCP NICOCP 3.0 (PCIe 5.0,Hot-swappable)
    NIC expansionEthernet/InfiniBand/Smart NIC

    Power supply

    Power supply rating800W/1300W/1600W/2000W/2400W/2700W/3200W
    Redundancy1+1 Hot-swappable redundant
    Energy efficiencyPlatinum rated/Titanium rated
    DCSupports-48V/336V DC power supply

    Chassis/Cooling

    Chassis specification2U Rack mount
    SP General-purpose chassisDepth 800mm
    AP General-purpose chassisDepth 850mm
    Accelerator chassisDepth 900mm

    Product images

    Images are references. Components, interfaces and the delivered configuration are specified in the quotation.

    Enquire about R4900 G7

    Provide quantity, workload and component requirements to confirm the configuration and quotation.

    Selection guides & documents

    H3C UniServer R4900 G7 Product Brochure

    Frequently asked questions

    Showing 2 of 2 questions for this model.

    View all model FAQs
    Why should the SP and AP memory configurations of the R4900 G7 be checked separately?

    The brochure lists separate DDR5 RDIMM and MRDIMM population counts and maximum speeds for SP and AP platforms. A platform-specific maximum must not be applied across platforms. State the CPU platform, memory type and population layout, rather than simply requesting a high-memory R4900 G7.

    Do the general-purpose and front-accelerator R4900 G7 chassis require the same installation space?

    Do not reserve space using a single depth. The document distinguishes SP general-purpose, AP general-purpose and front-accelerator chassis. All are 2U, but their depths differ. Check rack depth, rails, rear cabling and cooling clearance for the actual chassis, and confirm air or liquid cooling separately.